Classification of IR led(infrared led)
author: East Liu
2026-04-14
Infrared LED (IR LED) is a semiconductor device that converts electrical energy into near-infrared light (with a wavelength typically ranging from 760 to 1500 nm), and is widely used in fields such as remote control, security, communication, and healthcare. According to public information, its classification can be summarized as follows:
1).Classification by wavelength (key parameter, determining application scenarios):
850 nm: Slightly visible red light ("red burst"), suitable for security surveillance, night vision illumination, machine vision, etc.
940 nm: almost no red light, good concealment, commonly used in home appliance remote controls, facial recognition, etc.
808 nm / 830 nm / 870 nm / 905 nm / 1050 nm / 1300 nm / 1550 nm: These wavelengths are respectively used in special fields such as medical treatment, laser pumping, blood oxygen detection, food testing, and silicon-based sensing
940 nm: almost no red light, good concealment, commonly used in home appliance remote controls, facial recognition, etc.
808 nm / 830 nm / 870 nm / 905 nm / 1050 nm / 1300 nm / 1550 nm: These wavelengths are respectively used in special fields such as medical treatment, laser pumping, blood oxygen detection, food testing, and silicon-based sensing
2).Classified by power level:
Low power: 1–10 mW, diameter 3–5 mm, operating current approximately 20 mA, used for remote controls and proximity sensors.
Medium power: 20–50 mW, diameter 8 mm, current 50–100 mA.
High power: above 50 mW, up to 1–10 W, used for infrared lighting, industrial inspection, ETC systems, etc.
Medium power: 20–50 mW, diameter 8 mm, current 50–100 mA.
High power: above 50 mW, up to 1–10 W, used for infrared lighting, industrial inspection, ETC systems, etc.
3).Classified by packaging form:
DIP (Through-Hole Mounting): Such as T-1 (3 mm) and T-1 3/4 (5 mm), it has low cost and is suitable for traditional circuits.
SMD (Surface Mount Device): Supports automated production and is used in compact devices such as mobile phones and smart door locks.
COB (Chip On Board): Multi-chip integration, power range 1–10 W, used for high-altitude surveillance and industrial automation.
Flip Chip: High reliability, used in automotive LiDAR and medical equipment.
SMD (Surface Mount Device): Supports automated production and is used in compact devices such as mobile phones and smart door locks.
COB (Chip On Board): Multi-chip integration, power range 1–10 W, used for high-altitude surveillance and industrial automation.
Flip Chip: High reliability, used in automotive LiDAR and medical equipment.
4).Classified by launch angle:
Narrow angle (5°–30°): suitable for long-distance point-to-point communication.
Wide-angle (60°–180°): used for large-area coverage, such as infrared touch screens, automatic doors.
Wide-angle (60°–180°): used for large-area coverage, such as infrared touch screens, automatic doors.